Performance Boost With COM-HPC: The Computer-on-Module Revolution
Edge Computing Performance Demands
Advantech’s COM Express — with its diverse form factors and expansion capabilities — has set a benchmark for computers on modules for many years and has been widely adopted in numerous industries. The growth of edge computing, AIoT applications, and 5G networking has led customers to seek multi-core and high-speed I/O throughput in the form of 16 Core products. These customers are also seeking more PCIe expansion bus and at least 10G Ethernet to cope with the massive data flow at the edge. To meet these demands, designers have pragmatically integrated multiple computer-on-modules to yield more PCIe bus. Some have even built cluster computers to handle heavy loading and massive data processing. While these measures are often successful, they are subject to certain physical limitations caused by the 440-pin board to board connectors and finite bandwidth.
To satisfy diverse applications, computer-on-modules must feature a full range of processor options, quick I/O expansion capabilities, and enable easy migration/maintenance. These key characteristics help customers deploy products in particular target markets quickly. COM-HPC has unified Server/Client pinout types in two board to board connectors, helping customers easily configure their systems with different COM-HPC modules and painless optimization when migrating to next generation solutions. Advantech’s computer-on-modules provide reliable advanced performance for long term system operation. Both COM-HPC and COM Express deliver superior performance and “Super-Speed” expansion for further bandwidth requirements to supplement the computer-on-module product family.
COM-HPC is designed with 800-pins via 2x 400-pin board to board connectors. This power input and I/O interface pin assignment provides a stable power source for energy intensive applications and maximizes expansion bus usage.
Super-Speed Data Transmission and I/O Expansion Capabilities
The COM-HPC’s newly designed board to board connectors provide more pinouts and increase signal bandwidth to support new generation I/O interfaces. COM-HPC supports PCI Express connectivity up to Gen 5 (32GT/s) and a maximum 65 lanes. It provides 4x ports USB 4 or USB 3.2 Gen 2 x2, and 8x ports 25G Base-KR with sideband signal. Additionally, it features more low speed I/O pins for function communication with12x GPIO, SPI, IPMB, I2C, and SMBus.
There are two COM-HPC interface formats and 5 board sizes to serve varied embedded edge applications. The larger COM-HPC Server boards in sizes D & E, define headless applications and a 25Gb network with 4 to 8pcs long DIMM sockets, providing 512GB and 1TB of memory expansion respectively. The smaller COM-HPC Client boards in sizes A, B, & C, provide graphics and digital displays with 2 to 4pcs SODIMM sockets in a lower profile than the COM-HPC Server models. Advantech’s COM-HPC offers large scale of I/O expansion compared to COM Express. For detailed information, refer to the comparison I/O support and board size chart:
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